MOUNTING DEVICE AND MOUNTING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a mounting device and a mounting method, capable of suppressing heat conduction from the heated chip component to the outside.SOLUTION: Disclosed is a mounting device 1 in which chip components D are connected to a circuit board C arranged at a predetermined position of a suction table 14b of a stage 14 for regular crimping after heating the chip components D at the regular crimping temperature Tp and pressurizing them by a regular crimping load Fp. At a portion of the suction table 14b overlapping with connection positions of the chip components D in the circuit board C arranged on the suction table 14b of the stage 14 for the regular crimping, a heat insulation member 15 is provided supporting the circuit board C.SELECTED DRAWING: Figure 3