发明名称 金属ナノ粒子材料、それを含有する接合材料、およびそれを用いた半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a joint material capable of forming a joint layer having high joint strength at low temperature (e.g. 400°C or less).SOLUTION: It is found that a joint layer having a high joint strength at low temperature (e.g. 400°C or less) by using a metal nanoparticle material containing copper nanoparticles and nickel oxide nanoparticles at a predetermined ratio. More specifically, there is provided a metal nanoparticle material containing the copper nanoparticles of 99.995 to 97 mass% and the nickel oxide nanoparticles of 0.005 to 3 mass% based on the total metal nanoparticles. There are also provided metal nanoparticles consisting of the metal nanoparticles having diameters in a range of 1 to 1,000 nm, of 99% or more in number, based on the number of the total metal particles.
申请公布号 JP6032110(B2) 申请公布日期 2016.11.24
申请号 JP20130086839 申请日期 2013.04.17
申请人 株式会社豊田中央研究所 发明人 佐藤 敏一;明渡 邦夫;石崎 敏孝
分类号 B22F1/00;B82Y30/00;C22C9/00;H01B1/22;H01B5/00;H01L21/52 主分类号 B22F1/00
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