发明名称 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module
摘要 An IC module includes a lead frame having terminals that are to be connected to an antenna coil of an IC card, and an IC chip and multilayer chip capacitors for tuning mounted on the lead frame and encapsulated by a resin. The multilayer chip capacitors are mounted in grooves on the lead frame.
申请公布号 US6974909(B2) 申请公布日期 2005.12.13
申请号 US20030443789 申请日期 2003.05.23
申请人 SONY CORPORATION 发明人 TANAKA JUNICHI;TAKUBO HIROYUKI;ABE SHIGENOBU
分类号 B42D15/10;G06K17/00;G06K19/07;G06K19/077;H05K1/02;H05K3/20;H05K3/32;H05K3/34;(IPC1-7):H05K5/06;H01L23/28 主分类号 B42D15/10
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