发明名称 METHOD OF MANUFACTURING EPITAXIAL WAFER FOR SEMICONDUCTOR LIGHT EMITTING ELEMENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method to obtain an epitaxial wafer for a semiconductor light emitting element of a low operation voltage which takes a countermeasure so as not to generate thyristor characteristics, and which has good reproducibility and high luminance. <P>SOLUTION: In the method of manufacturing the epitaxial wafer for the semiconductor light emitting element, at least a light emitting unit 10 sandwiching an active layer 4 between an n-type clad layer 3 and a p-type clad layer 5, and a window layer 7 made of a semiconductor in which a p-type dopant is added in higher concentration than the p-type clad layer 5 on the light emitting unit 10, are laminated by an MOVPE method on a substrate 1. The flow of gas containing an n-type dopant is started during a temperature rising process before a first layer n-type semiconductor layer is grown on the substrate 1 or before the temperature rising, the state that the gas containing the n-type dopant flows is maintained, and a first layer n-type semiconductor layer is grown on the substrate 1. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005235800(A) 申请公布日期 2005.09.02
申请号 JP20040039194 申请日期 2004.02.17
申请人 HITACHI CABLE LTD 发明人 ARAI MASAHIRO;KONNO TAIICHIRO
分类号 H01L21/205;H01L33/14;H01L33/30;H01L33/42 主分类号 H01L21/205
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