| 发明名称 |
Printed circuit board with a coverlay film |
| 摘要 |
A printed circuit board assembly having a coverlay film which is a composite film consisting of a porous fluoropolymer film coated with a thermoplastic or heat-curing adhesive is disclosed. The coverlay film has excellent conformability and adhesion to the printed circuit board and low dielectric constant.
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| 申请公布号 |
US5473118(A) |
申请公布日期 |
1995.12.05 |
| 申请号 |
US19940268602 |
申请日期 |
1994.06.30 |
| 申请人 |
JAPAN GORE-TEX, INC. |
发明人 |
FUKUTAKE, SUNAO;OHASHI, KAZUHIKO;URAKAMI, AKIRA |
| 分类号 |
C09J7/02;C09J201/00;H05K3/28;H05K3/38;(IPC1-7):H05K1/00 |
主分类号 |
C09J7/02 |
| 代理机构 |
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