| 摘要 |
PROBLEM TO BE SOLVED: To provide a novel method of manufacturing copper wiring by which copper is embedded into a very small hole or a groove. SOLUTION: In the method of manufacturing the copper wiring provided with a step of electroplating the wiring connection holes or the wiring groove of a material to be plated with copper while forcibly stirring an electrolyte containing a copper component,≥1 wt.% water and≥1 wt.% copper complexing agent forming a complex with univalent copper ion, exhibiting a complexing constant of higher than 1×10<SP>3</SP>with univalent copper ion and≥0.5 g/L solubility of the complex formed with univalent copper under a use environment or copper complexing agent forming a complex with univalent copper ion, exhibiting a complexing constant of higher than 1×10<SP>3</SP>with univalent copper ion and a complexing constant of≤1×10<SP>20</SP>with 2-valent copper ion, an embedding rate of copper into fine holes is adjusted by controlling the degree of stirring to increase the embedding rate of the copper into the fine holes. COPYRIGHT: (C)2009,JPO&INPIT
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