| 发明名称 |
ELECTRONIC PACKAGE AND CONDUCTIVE STRUCTURE THEREOF |
| 摘要 |
An electronic package is provided, which includes: an insulator; an electronic element embedded in the insulator and having a sensing area exposed from the insulator; and a conductive structure disposed on the insulator and electrically connected to the electronic element, thereby reducing the thickness of the overall structure. |
| 申请公布号 |
US2016212851(A1) |
申请公布日期 |
2016.07.21 |
| 申请号 |
US201614990891 |
申请日期 |
2016.01.08 |
| 申请人 |
PHOENIX PIONEER TECHNOLOGY CO., LTD. |
发明人 |
Hu Chu-Chin;Hsu Shih-Ping |
| 分类号 |
H05K1/18;H05K1/11;H05K1/02 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic package, comprising:
an insulator having opposite first and second surfaces; an electronic element embedded in the first surface of the insulator and having at least a sensing area exposed from the first surface of the insulator; and a conductive structure disposed on the first surface of the insulator and electrically connected to the electronic element, wherein the sensing area is exposed from the conductive structure. |
| 地址 |
Hsinchu County TW |
