发明名称 Device with magnetic sensors with permanent magnets
摘要 A device with a magnetic sensor includes a substrate with a device layer. A magnetic sensor is formed on the device layer and includes a first permanent magnet. The first permanent magnet has at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer, with a barrier layer disposed between the FM layer and the AFM layer. The first permanent magnet is magnetized in a first direction at a temperature higher than a blocking temperature of the AFM layer. A plurality of device pads are coupled to the magnetic sensor. An integrated circuit substrate with a plurality of IC pads, wherein the plurality of device pads are selectively eutectic bonded to the plurality of IC pads at a bonding temperature greater than the blocking temperature of the AFM layer of the first permanent magnet.
申请公布号 US9513347(B2) 申请公布日期 2016.12.06
申请号 US201414510098 申请日期 2014.10.08
申请人 Invensense, Inc. 发明人 Shin Jong Il;Shin Jongwoo
分类号 G01R33/02;G01R33/038 主分类号 G01R33/02
代理机构 Minisandram Law Firm 代理人 Minisandram Law Firm ;Minisandram Raghunath S.
主权项 1. A device, comprising: a substrate, the substrate including a device layer; a magnetic sensor formed on the device layer, the magnetic sensor including at least a first permanent magnet and a plurality of sensing elements, wherein, the first permanent magnet deposited on a movable actuator, the first permanent magnet deposited with at least one alternating ferromagnetic (FM) layer and antiferromagnetic (AFM) layer, with a first barrier layer deposited between the FM layer and the AFM layer; and the first permanent magnet is magnetized in a first direction at a temperature higher than a blocking temperature of the AFM layer of the first permanent magnet; and wherein, the plurality of sensing elements including at least one electrode configured to move relative to the sensing elements, based upon a movement of the first permanent magnet deposited on the movable actuator; a plurality of device pads coupled to the magnetic sensor; and an integrated circuit substrate with a plurality of IC pads, wherein the plurality of device pads are selectively eutectic bonded to the plurality of IC pads at a bonding temperature greater than the blocking temperature of the first permanent magnet.
地址 San Jose CA US