发明名称 Very high-density DRAM cell structure and method for fabricating it
摘要 A vertical transistor semiconductor and method of making a vertical transistor is provided. The vertical transistor is particularly suited for use in a DRAM cell. The structure permits a DRAM cell to be fabricated with a comparatively low number of masking layers. Moreover, the vertical nature of the transistor allows a larger number of transistors per surface area compared to conventional techniques. The method and apparatus also utilizes a buried digit line. The digit line may include a portion that is a metal material that in a preferred embodiment is step-shaped sidewall of the digit line. The transistor is particular suited for use with a variety of DRAM capacitors.
申请公布号 US5753947(A) 申请公布日期 1998.05.19
申请号 US19950390295 申请日期 1995.01.20
申请人 MICRON TECHNOLOGY, INC. 发明人 GONZALEZ, FERNANDO
分类号 H01L21/8242;H01L27/108;(IPC1-7):H01L29/76 主分类号 H01L21/8242
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