发明名称 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To obtain an epoxy resin composition excellent in high-temperature storage stability and flame retardance by compounding an epoxy resin with a phenol resin, an inorganic filler, a cure accelerator, a specified amount of a red phosphorus flame retardant prepared by coating the surface of red phosphorus with aluminum hydroxide and then with a phenol resin and specified amount of a brominated epoxy resin. SOLUTION: This composition contains an epoxy resin preferably having an epoxy equivalent of 150-300; a phenol resin preferably having an OH equivalent of 80-250; 0.1-5 wt.% (based on the composition) red phosphorus flame retardant prepared by coating the surface of red phosphorus with aluminum hydroxide and then with a phenol resin, a brominated epoxy resin in such an amount that the bromine content of the composition is 0.1-0.5 wt.%, an inorganic filler, and a cure accelerator. Preferably, the flame retardant has an average particle size of 1-70μm, a max. particle size of 150μm or lower and a red phosphorus content of 60-95 wt.%.
申请公布号 JP2000319488(A) 申请公布日期 2000.11.21
申请号 JP19990129401 申请日期 1999.05.11
申请人 SUMITOMO BAKELITE CO LTD 发明人 TOMOKUNI MASATOYO
分类号 C08L63/00;C08G59/62;C08K3/00;C08K3/02;C08K9/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08L63/00
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