Method and device for producing waffle sandwich blocks

摘要

A device and a method produce multi-layered wafer blocks filled with a spreadable mixture such as a cream. A wafer base sheet coated with a spreadable mixture is transported along a first conveyor surface to a stacking area. A wafer cover sheet is transported along a second conveyor surface to the same stacking area. The wafer cover sheet is laid flat on the coated side of the wafer base sheet in the stacking area, and then the wafer base sheet and the wafer cover sheet are transported away together. The wafer cover sheet and wafer base sheet are moved respectively in the stacking area at a speed that is different from zero at all moments.

主权项

1. A method for producing multi-layer wafer blocks filled with a coating mass, which comprises the steps of:
providing an apparatus for producing multilayer wafer blocks filled with a coating mass including: a stacking area; a first conveying surface for transporting a wafer base sheet to the stacking area; a second conveying surface for transporting a wafer cover sheet to the stacking area; at least one positioning element for an exact positioning of the wafer cover sheet at least one above or on the wafer base sheet, the at least one positioning element configured to grip behind the wafer cover sheet and behind the wafer base sheet to center the wafer base sheet and wafer cover sheet above one another and push in the conveying direction, the at least one positioning element disposed movably in a conveying direction; a run-in area in which the first and the second conveying surface are configured to approach one another; separating elements running along the second conveying surface and disposed in the run-in area, the separating elements run asymptotically or in a wedge shape in a direction of the first conveying surface; the at least one positioning element having extensions projecting in the run-in area in the direction of the first conveying surface through openings disposed between the separating elements; transporting a wafer base sheet coated with the coating mass along the first conveying surface to the stacking area; transporting a wafer cover sheet along the second conveying surface to the stacking area; supplying the wafer cover sheet to a coated side of the wafer base sheet and placed flat thereon, in the stacking area; removing jointly the wafer base sheet and the wafer cover sheet; moving each of the wafer cover sheet and the wafer base sheet in the stacking area at a speed which is non-zero at each time point; transporting the wafer cover sheet by the at least one positioning element in a conveying direction in a direction of the stacking area; and pushing the wafer base sheet by the at least one positioning element into the stacking area, the at least one positioning element grips behind the wafer cover sheet and behind the wafer base sheet and thereby centers the wafer base and cover sheets above one another and pushes in the conveying direction.