| 摘要 |
PROBLEM TO BE SOLVED: To simplify a sealing process for a connection part between each flexible substrate and each mount terminal in an electro-optic substrate in which a plurality of data line control circuits are mounted by a COF system, and to avoid an increase in thickness of the entire electro-optic substrate.SOLUTION: A terminal part is provided along one side of an electro-optic substrate in a scanning line direction, and first and second mount terminals 12-1 and 12-2 for connecting first and second flexible substrates 30-1 and 30-2 mounted with data line control circuits respectively are arranged in a direction of drawing data lines. In a sealing step of applying resin 50-1 to 50-3 for sealing a bonding part between the first flexible substrate 30-1 and the first mount terminal 12-1 and a bonding part between the second flexible substrate 30-2 and the second mount terminal 12-2, the resin is applied so that parts of the former bonding part and the latter bonding part that face each other are sealed with a common resin member 50-2. |
