发明名称 POLISHING DEVICE AND POLISHING METHOD USING SAME
摘要 PURPOSE:To provide a polishing device capable of improving flatness microscopically by way of uniforming the contact state of an abrasive cloth surface and a sample polished surface, improving flatness of a sample and uniforming a polishing amount to the sample polished surface macroscopically. CONSTITUTION:On the opposite side of a sample holding pedestal 3 free to rotate, placing a sample B on it, a rotatable polishing disc 1 is arranged, and on its bottom face, an abrasive cloth 2 is affixed through an elastic body 201. Polish is carried out as the polishing disc 1 and the sample holding pedestal 3 rotate, an abrasive 8 is supplied between the abrasive cloth 2 and the sample polished surface and the abrasive cloth 2 makes contact with the sample B in a narrow range.
申请公布号 JPH05285825(A) 申请公布日期 1993.11.02
申请号 JP19930023035 申请日期 1993.02.10
申请人 SUMITOMO METAL IND LTD 发明人 BEPPU TOSHIYASU;WATANABE JUNJI
分类号 B24B29/00;B24B13/01;B24B37/005;B24B37/04;B24B37/20;B24B37/22;B24B37/24;B24B37/26;B24B41/06 主分类号 B24B29/00
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