发明名称 THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS GOODS DERIVED FROM THESE
摘要 PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is easily cured by heating and can give cured products having satisfactory characteristics such as heat resistance, chemical resistance, high surface hardness, and high refractive index; and cured products obtained from the composition. SOLUTION: The thermosetting resin composition contains (A) a condensate obtained by the hydrolysis and condensation of (a1) a thiol-group-containing alkoxysilane compound represented by general formula (1): R<SP>1</SP>Si(OR<SP>2</SP>)<SB>3</SB>(wherein R<SP>1</SP>is a 1-8C hydrocarbon group having at least one thiol group or an aromatic hydrocarbon group having at least one thiol group; and R<SP>2</SP>is a hydrogen atom, a 1-8C hydrocarbon group, or an aromatic hydrocarbon group) and at least one compound selected from among (B) epoxy compounds and/or (C) isocyanate compounds. COPYRIGHT: (C)2007,JPO&INPIT
申请公布号 JP2007217673(A) 申请公布日期 2007.08.30
申请号 JP20070007054 申请日期 2007.01.16
申请人 OSAKA CITY;ARAKAWA CHEM IND CO LTD 发明人 MATSUKAWA KOYO;FUKUDA TAKESHI;AIDA HIDEKI
分类号 C08L83/08;C08J5/24;C08K5/29;C08L63/00;H01L23/14;H01L23/29;H01L23/31 主分类号 C08L83/08
代理机构 代理人
主权项
地址