发明名称 |
THERMOSETTING RESIN COMPOSITION, CURED PRODUCT THEREOF, AND VARIOUS GOODS DERIVED FROM THESE |
摘要 |
PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which is easily cured by heating and can give cured products having satisfactory characteristics such as heat resistance, chemical resistance, high surface hardness, and high refractive index; and cured products obtained from the composition. SOLUTION: The thermosetting resin composition contains (A) a condensate obtained by the hydrolysis and condensation of (a1) a thiol-group-containing alkoxysilane compound represented by general formula (1): R<SP>1</SP>Si(OR<SP>2</SP>)<SB>3</SB>(wherein R<SP>1</SP>is a 1-8C hydrocarbon group having at least one thiol group or an aromatic hydrocarbon group having at least one thiol group; and R<SP>2</SP>is a hydrogen atom, a 1-8C hydrocarbon group, or an aromatic hydrocarbon group) and at least one compound selected from among (B) epoxy compounds and/or (C) isocyanate compounds. COPYRIGHT: (C)2007,JPO&INPIT |
申请公布号 |
JP2007217673(A) |
申请公布日期 |
2007.08.30 |
申请号 |
JP20070007054 |
申请日期 |
2007.01.16 |
申请人 |
OSAKA CITY;ARAKAWA CHEM IND CO LTD |
发明人 |
MATSUKAWA KOYO;FUKUDA TAKESHI;AIDA HIDEKI |
分类号 |
C08L83/08;C08J5/24;C08K5/29;C08L63/00;H01L23/14;H01L23/29;H01L23/31 |
主分类号 |
C08L83/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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