STACK PACKAGE FOR HIGH DENSITY MOUNTING,申请号KR19950042103-传众专利搜索

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发明名称	STACK PACKAGE FOR HIGH DENSITY MOUNTING
摘要
申请公布号	KR0156329(B1)	申请公布日期	1998.10.15
申请号	KR19950042103	申请日期	1995.11.18
申请人	SAMSUNG ELECTRONICS CO.,LTD	发明人	KWON, YOUNG-DO
分类号	H01L25/03;(IPC1-7):H01L25/03	主分类号	H01L25/03
代理机构		代理人
主权项
地址

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