| 摘要 |
PROBLEM TO BE SOLVED: To provide a forming method in which the machining time of a via hole can be shortened without a complicated wet pretreatment, by a method wherein the via hole which reaches a metal film is formed, by a laser beam, in a polymer film on the metal film and a via-hole machined residue is removed by a dry treatment. SOLUTION: Respective laser beams are scanned, inside the face of an X-Y stage 18, by a first scanning mirror 13 and a second scanning mirror 14 in which two mirrors capable of being turned to mutually different directions are combined so as to correspond to a first solid-state laser oscillation part 11 used to radiate an infrared-range laser beam and to a second excimer laser oscillation part 12 used to radiate an ultraviolet or visible-range laser beam. A first converging fθlens 15 and a second converging fθlens 16 focus the laser beams so as to be incident vertically on an object 17, to be machined, irrespective of angles of incidence of the respective laser beams from the two-axis scanning mirrors 13, 14. Then, the two-axis scanning mirrors 13, 14 are combined with the fθlenses 15, 16, a via hole can be formed in a prescribed position on the object 17, to be machined, even when the object 17 to be machined is not moved by using the X-Y stage 18. Consequently, a machined residue can be removed simultaneously. |
