发明名称 Electronic component and method of manufacture
摘要 An electronic component includes a substrate (110) and an airbridge (890) located over the substrate. The airbridge has at least a first layer and a second layer over the first layer. The airbridge is electrically conductive where the first layer of the airbridge is less resistive than the second layer of the airbridge.
申请公布号 KR100779869(B1) 申请公布日期 2007.11.27
申请号 KR20037000485 申请日期 2003.01.13
申请人 发明人
分类号 H01L21/768;H01L23/482;H01L23/522 主分类号 H01L21/768
代理机构 代理人
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