| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a surface mounting device for preventing solder cracks caused by a difference in thermal expansion coefficient from a set substrate. <P>SOLUTION: A method of packaging an electronic component, in which the electronic component for surface mounting has mounting electrodes 5 at least on both ends of the outer bottom of the electronic component and is connected to circuit terminals 8 of a set substrate 7 with solder 9, wherein protrusions 11 larger in thickness than the circuit terminals 8 are provided on a surface of the set substrate 7 opposed to the outer bottom of the electronic component for surface mounting and the thickness of the solder 9 between the mounting electrodes 5 and the circuit terminals 8 is kept large. <P>COPYRIGHT: (C)2009,JPO&INPIT</p> |
