Securing mechanism and method for wafer bonder

摘要

Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.

主权项

1. A method for bonding a wafer to a plate, the method comprising:
applying an adhesive between a wafer and a plate so as to form an assembly of the wafer and the plate; positioning the assembly on a bonding area; positioning a lid over the bonding area, the lid having an outside surface and an inside surface, the inside surface configured to facilitate application of pressure to the assembly; applying a pushing force on the outside surface of the lid so as to secure the lid in a substantially fixed orientation, the inside surface of the lid and the bonding area forming at least part of a bonding chamber dimensioned to hold the assembly when the lid is positioned over the bonding area and secured in the substantially fixed orientation, the pushing force directed along a direction having a component that is perpendicular to a plane defined by the wafer, the pushing force applied external to the bonding chamber; and bonding the assembly by applying at least heat to the assembly.