| 摘要 |
A printed circuit board with an electrically conductive bonding pad disposed on an outer surface of the printed circuit board. The bonding pad has a bonding pad perimeter at immediately bounding edges of the bonding pad. An electrically conductive via directly electrically contacts the bonding pad, and is disposed within the printed circuit board relative to the bonding pad. The via has a via perimeter at immediately bounding edges of the via. The via perimeter overlaps the pad perimeter such that a portion of the via perimeter is within the pad perimeter and a portion of the via perimeter is outside the pad perimeter. In various embodiments, the bonding pad is a ball bonding pad. |
