发明名称 METHOD AND APPARATUS FOR DETECTING DEFECT
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for detecting defects or a foreign matter by using a signal obtained by separating light which is emitted from substantially the entire hemispherical surface having a test object as the bottom, into a plurality of different polarization components and by detecting them, in order to enable the harmful defects or foreign matters to be detected so as to be separated from non-defects, such as surface roughness of interconnections. SOLUTION: The defect detecting apparatus for detecting foreign matters attaching to the surface of a substrate sample (wafer) having circuit patterns, such as the interconnections, is provided with stages which can be moved arbitrarily in each of X, Y, Z andθdirections, in a state where the substrate sample is mounted thereon; and an illumination optical system for illuminating the circuit patterns along one or plural directions. By having reflected light, diffracted light, or scattered light, coming from an inspection region being illuminated, are detected through substantially the entire hemispherical surface having the wafer as the bottom, detection with an NA (numerical aperture) that is located within a range of 0.7 to 1.0 is carried out. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008096430(A) 申请公布日期 2008.04.24
申请号 JP20070236104 申请日期 2007.09.12
申请人 HITACHI HIGH-TECHNOLOGIES CORP 发明人 NAKANO HIROYUKI;YOSHITAKE YASUHIRO;NAKADA TOSHIHIKO;UENO TAKETO
分类号 G01N21/956;G01B11/30;H01L21/66 主分类号 G01N21/956
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