摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a head which can reduce a size of a drive circuit board for structuring a holding part, and can reduce cost.SOLUTION: In a manufacturing method of a head 1 including a passage forming substrate 10 having two piezoelectric actuator arrays 310, a drive circuit 120, and a drive circuit board 30 having a first bump 31 and a second bump 32, the first bump 31 of the drive circuit board 30 is arranged on the outer side of the piezoelectric actuator array 310, adhesive layers 39 are formed on both sides of the first bump 31 and the second bump 32. A first through hole 35 and a second through hole 36 are formed on the drive circuit board 30, and first connection wiring 311 and second connection wiring 312 to be connected to the drive circuit 120 are arranged on the drive circuit board. A first electrode 60 and the first connection wiring 311 of the piezoelectric actuator 300 are electrically connected by the first bump 31, and a second electrode 80 and the second connection wiring 312 are electrically connected by the second bump 32.SELECTED DRAWING: Figure 3 |