MULTILAYER ADHESIVE FILM AND FLEXIBLE METAL-CLAD LAMINATE

摘要

The present invention provides a film for circuit boards, which has low dielectric constant and low dielectric loss tangent, while having small dimensional change rate. The present invention is able to solve the above-described problem by: a multilayer adhesive film which is obtained by providing at least one surface of a non-thermoplastic polyimide film with an adhesive layer containing a thermoplastic polyimide, and which has a specific physical property; and a flexible metal-clad laminate which uses this multilayer adhesive film.