| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which allows reduction of a chip size thereof, while ensuring the accuracy of a resistance value of a thin film resistive element to be kept in a given error range. SOLUTION: In the state in which a photo-resist 30 covers a resistive film 22 formed on a surface of a 1st Al wiring 14, it is possible to form a thin film resistive element 16 having a resistance value within a given error range in a second region N where the photo-resist 30 is formed to have a substantially uniform thickness, and further it is possible to form a resistor having a resistance value permitted to be beyond a given error range in a first region M where the photo-resist 30 is formed to have a non-uniform thickness, the non-uniformity being created by a level difference H between the 1st Al wiring 14 and a BPSG film 13. Because this makes it possible to arrange resistors such as a pull-up resistor 17 and a current-limiting resistor 18 permitting their resistance values to be beyond a given error range in the first region M, which has been left as a dead space, it is feasible to reduce a chip size smaller. COPYRIGHT: (C)2008,JPO&INPIT
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