| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a wiring board of which the upper surface of a conductive circuit is flat by a semi-additive method. SOLUTION: A method includes a plating resist step of arranging a plating resist layer 4 of a pattern opposite to a circuit pattern on the surface of a conductive seed layer 3 provided on an insulating base material 2, a plating step of arranging a conductive circuit 5 of the circuit pattern by an electrolytic plating on the surface of the conductive seed layer 3 which is not covered with the plating resist layer 4, a flattening grinding step of grinding the upper part of the conductive circuit 5 along with the plating resist layer 4 until the upper surface of the conductive circuit 5 becomes flat, a plating resist layer removing step of removing the plating resist layer 4, and a seed layer removing step of removing the place of the conductive seed layer 3 where no conductive circuit 5 is provided. COPYRIGHT: (C)2008,JPO&INPIT
|
