发明名称 JET SOLDERING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a jet soldering apparatus at a low cost, being highly reliable, having a small outline, especially small projected cross section, and being highly practical. SOLUTION: The jet soldering apparatus includes: a solder tub for storing molten solder; an axial flow type impeller installed in the solder tub and combined with a first rotary body having a permanent magnet; a nozzle for injecting molten solder forcedly fed by the axial flow type impeller to a workpiece; a motor installed outside the solder tub and combined with a second rotary body having a permanent magnet for rotating the first rotary body. The apparatus is characterized in that the nozzle, solder tub, axial flow type impeller, first rotary body, second rotary body, and motor are aligned in the direction to which the gravity is applied. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008087068(A) 申请公布日期 2008.04.17
申请号 JP20060273911 申请日期 2006.10.05
申请人 DENSO CORP 发明人 OSAWA TAKUYA
分类号 B23K1/08;B23K101/42;H05K3/34 主分类号 B23K1/08
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