| 摘要 |
The present invention relates to a layer structure (1) which has at least one metal member (2) and at least one polyamide layer (3) locally arranged on the metal member (2) in order to improve resistibility. The layer structure (1) desirably includes an insulated electric conductor. In the layer structure, the polyamide layer (3) includes a polyamide molding composition which is a mixture comprising: (a) polyamide which has a glass transition temperature (Tg) equal to or greater than 130°C and has basic materials of cycloaliphatic diamines, or alicyclic dicarboxylic acids, or both cycloaliphatic diamines and alicyclic dicarboxylic acids, or a compound of the polyamide; (b) at least one monomer of being selected from branched or nonbranched C2-C12 alkene or a compound thereof, and additionally a next group and a polyolefin having basic materials such as maleic anhydride, itaconic anhydride, glycidyl acrylate, glycidyl methacrylate, acrylic acid, methacrylic acid, vinyl acetate, C1-C2 alkyl acrylate, C1-C2 alkyl methacrylate, substituted or unsubstituted styrene, or a compound of the monomer; (c) the component (a) as a selective component, a different aliphatic polyamide, or a compound of the polyamide; and (d) an additive as a selective component. |
