| 发明名称 |
THERMAL INK JET PRINTHEAD |
| 摘要 |
The present disclosure includes a method of fabricating a thermal ink jet printhead including depositing a first metal layer having a thickness to form a power bus, deposing a first dielectric layer, forming a via in the first dielectric layer to connect the first metal layer to a second metal layer, depositing the second metal layer, depositing a resistive layer, forming a thermal resistor in the resistive layer, depositing a second dielectric layer, and removing a portion of the second dielectric layer. |
| 申请公布号 |
US2016325547(A1) |
申请公布日期 |
2016.11.10 |
| 申请号 |
US201415111269 |
申请日期 |
2014.01.29 |
| 申请人 |
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. |
发明人 |
White Lawrence H.;Fuller Anthony M.;Pham Huyen |
| 分类号 |
B41J2/14;B41J2/16 |
主分类号 |
B41J2/14 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for fabricating a thermal ink jet printhead, comprising:
depositing a first metal layer on a substrate having a thickness to form a power bus; depositing a first dielectric layer; forming a via in the first dielectric layer to connect the first metal layer to a second metal layer; depositing the second metal layer; depositing a resistive layer; forming a thermal resistor in the resistive layer; depositing a second dielectric layer; and removing a portion of the second dielectric layer using a directional etch process. |
| 地址 |
Houston TX US |
