| 摘要 |
PROBLEM TO BE SOLVED: To suppress deterioration of reliability.SOLUTION: The electronic component mounting apparatus comprises a stage for holding a wiring board, a head unit 15, and a control device. The head unit 15 includes a holding tool 29 for holding the semiconductor chip and a heater for heating the holding tool 29. The head unit 15 is disposed above the stage, and moves the holding tool 29 in the vertical direction. The control device sucks gas from the chip holding hole 29a of the holding tool 29 to suck and hold the semiconductor chip, to press a connection terminal of the semiconductor chip against a solder bump of the wiring board. Then, the heater heats the solder bump via the holding tool 29 and the semiconductor chip. Then, after fusing the solder bumps, the control device switches the holding of the semiconductor chip to the non-contacting state in which gas is discharged from the chip holding hole 29a of the holding tool 29 to between the holding tool 29 and the semiconductor chip to hold the semiconductor chip to the holding tool 29 without contacting.SELECTED DRAWING: Figure 2 |
