Production of multiple layer ceramic composite used in electronics industry comprises forming metallic layer structures on film-like intermediate support, positioning support between films and forming composite

摘要

The production of a multiple layer ceramic composite comprises forming metallic layer structures on a film-like intermediate support (2) made from a material which is fired, vaporized and/or sublimed in a region between the baking temperature of the binder materials and the sintering temperature of the ceramic foils, positioning the intermediate support between at least two films or plates made from non-fired ceramic and forming a composite under the influence of pressure and temperature. A baking and sintering process is carried out, in which the intermediate support is fired, vaporized and/or sublimed and removed from the composite. A force exerting a uniaxial pressure is applied to the composite temporarily during the baking and sintering process.