发明名称 |
INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH MAGNETIC FILM |
摘要 |
An integrated circuit package-in-package system comprising: connecting a first integrated circuit device and a package substrate; applying a magnetic film over the first integrated circuit device; mounting a second integrated circuit device having an inner encapsulation over the magnetic film; and forming a package encapsulation over the first integrated circuit device, the magnetic film, and the second integrated circuit device.
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申请公布号 |
US2008315374(A1) |
申请公布日期 |
2008.12.25 |
申请号 |
US20070768041 |
申请日期 |
2007.06.25 |
申请人 |
KIM SUNG SOO;KIM DONGSIK;KWON CHOONGHWAN |
发明人 |
KIM SUNG SOO;KIM DONGSIK;KWON CHOONGHWAN |
分类号 |
H01L23/552;H01L21/56 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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