发明名称 MOISTURE-CURABLE HOT MELT ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a moisture curable hot melt adhesive excellent in holding powder of a sheet at high temperature (50°C) while having ordinal condition adhesive strength and heat creep resistance at high levels.SOLUTION: The moisture curable hot melt adhesive is a reaction product of a polyisocyanate compound and a raw material composition containing crystalline polyester polyol of 20 to 30 mass%, polyether polyol of 35 to 40 mass%, an acrylic copolymer having glass transition temperature of 50 to 90°C of 15 to 25 mass% and thermoplastic polycaprolactone of 3 to 7 mass% and contains an urethane polymer containing an isocyanate group in a terminal.SELECTED DRAWING: None
申请公布号 JP2016204541(A) 申请公布日期 2016.12.08
申请号 JP20150088873 申请日期 2015.04.24
申请人 SEKISUI FULLER CO LTD 发明人 KIMURA OSAMU
分类号 C09J175/06;C08G18/10;C09J175/04;C09J175/08 主分类号 C09J175/06
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