| 摘要 |
PROBLEM TO BE SOLVED: To provide a film carrier tape for preventing shorting of wiring patterns and also provide a method of manufacturing an electronic component mounting film. SOLUTION: COF is obtained on a long-length base material 151 formed of polyimide from a film carrier tape 150 forming a plurality of wiring patterns 52 arranged in the longitudinal direction holding isolated regions and a plurality of sprocket holes 157 arranged in the longitudinal direction. A couple of hole lines 157a holding the wiring pattern 52 are formed with a plurality of sprocket holes 157 and the plurality of sprocket holes 157 included in the same hole line 157a are extending in the longitudinal direction of the base material 151 and are surrounded with a reinforcement layer 153 formed of copper. Separating slits 154 are respectively formed along the width direction of the base material 151 to the same position corresponding to the separating region in regard to the longitudinal direction of the base material 151 in a couple of reinforcement layers 153. In the cutting process, the film carrier tape 150 is cut to pass through the separating slit 154. COPYRIGHT: (C)2008,JPO&INPIT
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