CIRCUIT BOARD AND ELECTRONIC DEVICE

摘要

In the present invention, a circuit board includes: a metal circuit board; a metal heat-diffusing plate disposed below the metal circuit board; a metal heat-dissipating plate disposed below the heat-diffusing plate; an insulating substrate disposed between the metal circuit board and the heat-diffusing plate, the top surface of the insulating substrate being joined to the bottom surface of the metal circuit board, and the bottom surface of the insulating substrate being joined to the top surface of the heat-diffusing plate; and an insulating substrate disposed between the heat-diffusing plate and the heat-dissipating plate, the top surface of the insulating substrate being joined to the bottom surface of the heat-diffusing plate, and the bottom surface of the insulating substrate being joined to the top surface of the heat-dissipating plate. The diameter of the metal particles contained in the heat-diffusing plate decrease in size in the direction from each of the top surface and bottom surface of the heat-diffusing plate toward the thickness-direction center of the heat-diffusing plate.