Robot blade design

摘要

The present disclosure relates to a wafer transfer robot having a robot blade that can be used to handle substrates that are patterned on both sides without causing warpage of the substrates. In some embodiments, the wafer transfer robot has a robot blade coupled to a transfer arm that varies a position of the robot blade. The robot blade has a wafer reception area that receives a substrate. Two or more spatially distinct contact points are located at positions along a perimeter of the wafer reception area that provide support to opposing edges of the substrate. The two or more contact points are separated by a cavity in the robot blade. The cavity mitigates contact between a backside of the substrate and the robot blade, while providing support to opposing sides of the substrate to prevent warpage of the substrate.

主权项

1. A wafer transfer robot, comprising
a robot blade comprising a wafer reception area configured to receive a substrate, wherein the wafer reception area comprises a plurality of contact structures located at positions along a perimeter of the wafer reception area, which have a plurality of contact points configured to contact the substrate and provide support to opposing edges of the substrate and that are separated by a cavity in the robot blade; a transfer arm connected to the robot blade at a first connection point and configured to vary a position of the robot blade; wherein one or more of the plurality of contact structures have a tapered sidewall comprising a first one of the plurality of contact points; and wherein one or more of the plurality of contact structures comprise a stepped structure having a first step with a horizontal surface comprising a second one of the plurality of contact points.