摘要 |
PROBLEM TO BE SOLVED: To provide a current test method capable of raising the surface temperature on a semiconductor chip without excessively raising the outside surrounding temperature even when self-heating of a test sample for pulse current test etc. is small.SOLUTION: The current test method includes the steps of: preparing a test sample in which a semiconductor chip is mounted on a package and a heater; placing the test sample on the heater; supplying a current to the semiconductor chip under a condition that the heat resistance between the semiconductor chip and the heater in the test sample is higher than the heat resistance between the semiconductor chip and the heater in a product mode.SELECTED DRAWING: Figure 2 |