发明名称 CURRENT TEST METHOD
摘要 PROBLEM TO BE SOLVED: To provide a current test method capable of raising the surface temperature on a semiconductor chip without excessively raising the outside surrounding temperature even when self-heating of a test sample for pulse current test etc. is small.SOLUTION: The current test method includes the steps of: preparing a test sample in which a semiconductor chip is mounted on a package and a heater; placing the test sample on the heater; supplying a current to the semiconductor chip under a condition that the heat resistance between the semiconductor chip and the heater in the test sample is higher than the heat resistance between the semiconductor chip and the heater in a product mode.SELECTED DRAWING: Figure 2
申请公布号 JP2016166807(A) 申请公布日期 2016.09.15
申请号 JP20150047063 申请日期 2015.03.10
申请人 TOSHIBA CORP 发明人 TAKAGI KAZUTAKA;KURODA KENTA;TAKATSUKA SHINJI
分类号 G01R31/26 主分类号 G01R31/26
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