ELECTRIC CIRCUIT MODULE AND POWER CONVERSION APPARATUS MOUNTING IT, AND VEHICLE-MOUNTED ELECTRICAL MACHINE SYSTEM

摘要

PROBLEM TO BE SOLVED: To provide a power module which can improve heat dissipation between a heat dissipation member and a semiconductor device, and can realize securing in the heat dissipation member of a semiconductor device without using the new configuration of module components.

SOLUTION: This power module constitutes a pressurizing jig by stacking an elastic member 8, a DC anode side wiring member 5 to which a current circulates bidirectionally, and a DC cathode side wiring member 6. A first fixture jig 1 is pushed with this pressurizing jig, the semiconductor device 3 is pushed by the first fixture jig 1, and the semiconductor device 3 is fixed to a heat dissipation member 2 in the state that the heat sink surface is brought into surface contact with the side wall sides 2c and 2d of the heat dissipation member 2.

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