MULTILAYER PRINTED WIRING BOARD, AND CONNECTION STRUCTURE OF MULTILAYER PRINTED WIRING BOARD AND CONNECTOR

摘要

A multilayer printed wiring board including insulating layers, ground layers thereon, and at least one via hole. The ground layers include a wiring layer and a first impedance adjustment layer. The wiring layer includes a solid conductor and a conductive line. The conductive line is disposed inside an opening and a passage of the solid conductor. The first impedance adjustment layer includes a solid conductor having an opening. The via hole is located inside the openings of the wiring layer and the first impedance adjustment layer and is connected to the conductive line. A first distance is smaller than a second distance, where the first distance is a distance from an outline of the opening of the wiring layer to the via hole, and the second distance is a distance from an outline of the opening of the first impedance adjustment layer to the via hole.

主权项

1. A multilayer printed wiring board comprising:
a plurality of insulating layers; a plurality of ground layers on the respective insulating layers, the ground layers including:
a wiring layer including:
a solid conductor having an opening and a passage, the passage communicating with the opening, anda conductive line inside the opening and the passage, anda first impedance adjustment layer including a solid conductor, the solid conductor of the first impedance adjustment layer having an opening; and at least one via hole in at least one of the insulating layers and at least one of the ground layers, the via hole being located inside the opening of the wiring layer and inside the opening of the first impedance adjustment layer and being connected to the conductive line, wherein a first distance is smaller than a second distance, where
the first distance is a distance in a first direction from an outline of the opening of the wiring layer to the via hole, andthe second distance is a distance in the first direction from an outline of the opening of the first impedance adjustment layer to the via hole, and the first direction is a plane direction of the multilayer printed wiring board.