| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a heat-resistant negative photosensitive resin composition also having good sensitivity and resolution, a pattern forming method using the composition in which the composition is developable with an alkaline aqueous solution and excels in sensitivity, resolution and heat resistance and by which a pattern of a good shape is obtained, and to provide high-reliability electronic components. <P>SOLUTION: The negative photosensitive resin composition is spin-coated and dried on a semiconductor substrate 1 on which a first conductor layer 3, a second conductor layer 7 and an interlayer insulating film 4 have been formed, and light is illuminated through a mask of a pattern for forming a window 6C in a predetermined portion. After development with an alkaline aqueous solution, heating (curing) is carried out to form a surface protective film 8. The negative photosensitive resin composition comprises (a) an alkaline aqueous solution-soluble polymer having phenolic hydroxyl groups at terminals, (b) a compound which generates an acid upon irradiation with an actinic ray, and (c) a compound which is crosslinked or polymerized by the action of an acid. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
