| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which has a high heat dissipation efficiency and is highly reliable. <P>SOLUTION: The semiconductor device 10 has an outer electrode 34, a semiconductor element 28 having a plurality of strip electrodes 37 arranged in parallel at every a prescribed distance, and a conductor 32 electrically connecting the strip electrodes 37 of the semiconductor element 28 to the outer electrode 34. The conductor 32 has a plate conductor body 38 and a plurality of projecting stripe contacts 44 which are projected from one main surface 40 of the conductor body 38 and arranged in parallel at the same distance as that of the strip electrodes 37. The semiconductor element 28 is connected to the outer electrode 34 via the conductor 32 by making projecting stripe contacts 44 come in contact with the strip electrodes 37. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
