| 摘要 |
PROBLEM TO BE SOLVED: To satisfy both of the low viscosity of a resin varnish having low dielectric loss tangent, used for production of a multilayer printed wiring board having low dielectric loss tangent and the storage stability of the vanish and finally improve productivity of the multilayer printed wiring board having low dielectric loss tangent. SOLUTION: The resin varnish having low dielectric loss tangent comprises (A) a thermosetting monomer having≤1,000 weight-average molecular weight, (B) a polymer having≥5,000 weight-average molecular weight, (C) a halogen-based flame retardant, (D) a silicon oxide filler and (E) an organic solvent, and average particle diameters of the components C and D are together 0.2-3.0μm. COPYRIGHT: (C)2007,JPO&INPIT |
