| 摘要 |
A contact pin (50) to be in contact with a terminal of a wafer for supplying a signal to the wafer comprises a first conductive layer (51b) composed of a first conductive material having a relatively high hardness compared to an oxide coating film formed on the terminal, a second conductive layer (51c) composed of a second conductive material having a relatively low hardness compared to the oxide coating film, and a base (51a) on the outer side of which the first conductive layer (51b) and the second conductive layer (51c) are formed. The first conductive layer (51b) is formed in close contact with the outer side of the second conductive layer (51c), and both the first conductive layer (51b) and the second conductive layer (51c) are exposed in the front end face (50a) of the contact pin (50). |
