发明名称 |
PRINTED CIRCUIT BOARD AND THE METHOD THEREOF |
摘要 |
According to the present invention, a printed circuit board comprises: a core substrate having a cavity; and a dummy chip received in the cavity. The printed circuit board completes the dummy chip by directly processing a glass substrate. A bending phenomenon of the substrate is improved by embedding the completed dummy chip in the substrate, thereby improving reliability of the embedded substrate. |
申请公布号 |
KR20160097800(A) |
申请公布日期 |
2016.08.18 |
申请号 |
KR20150020108 |
申请日期 |
2015.02.10 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE, JOON SUNG;CHO, SUK HYEON;LEE, YONG SAM |
分类号 |
H05K1/18;H05K3/00;H05K3/46 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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