| 摘要 |
<p>A UV curable composition comprising a UV curable epoxy-functional essentially solver: fee reactant, a UV curing agent. In certain embodiments, the composition also may comprise a conductive filler, which may be present at a selected concentration, particle size distribution and shape, wherein said composition, subsequent to cure, provides a deposited conductive film whose conductivity is controlled by said conductive filler concentration, particle size distribution and shape.</p> |
