CHUCK ASSEMBLY FOR CONTACTLESS SUPPORT OF A WAFER

摘要

A contactless wafer chuck assembly is provided to decrease the inferiority rate about the semiconductor chip and minimize the deformation of wafer by forming the whirlpool of the air in the support chamber. The contactless wafer chuck assembly comprises the fan chamber(120) of the disc shape; and a plurality of support chambers(130) which are arranged radically while being opened to the upper side. A chuck(100) includes a fan chamber and a connection pathway(140) connecting the plurality of support chambers. A centrifugal fan(121) is inserted into the fan chamber of chuck and is rotated. A plurality of support chambers are the cylindrical shape. The connection pathway is connected to the support chamber.