| 发明名称 |
COMPREHENSIVE LAYOUT STRATEGY FOR FLIP CHIPPING INTEGRATED CIRCUITS |
| 摘要 |
In accordance with an example embodiment of the present invention, an apparatus is disclosed. The apparatus includes a substrate and a signal trace at the substrate. The signal trace has a first trace portion with a first trace width and a second trace portion with a second trace width. The second trace width is greater than the first trace width. |
| 申请公布号 |
WO2016149269(A1) |
申请公布日期 |
2016.09.22 |
| 申请号 |
WO2016US22469 |
申请日期 |
2016.03.15 |
| 申请人 |
FCI ASIA PTE. LTD;FCI AMERICAS TECHNOLOGY LLC |
发明人 |
JIANG, Chenhui;BRETSCHNEIDER, Lars;KEIL, Ulrich |
| 分类号 |
H05K1/02;H01L23/48;H05K3/46 |
主分类号 |
H05K1/02 |
| 代理机构 |
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