| 摘要 |
PURPOSE:To obtain a preferable resin mold by absorbing fluctuation in the thickness of moldings. CONSTITUTION:The metal mold for producing a resin molded semiconductor is provided, in the insert dies 16a, 16b abutting against an item to be molded and closed, with cuts 30 for imparting the resiliency in the closing direction to insert metal dies 16a, 16b at a plurality of positions in the thickness direction thereof while directing alternately from one end face toward the other end face. |
