Bump electrode for connecting electronic components

摘要

The present invention relates to connecting electronic components using bump electrodes to connect electronic components such as semiconductors with the patterning electrodes of a circuit board. In order to prevent deterioration in connecting reliability due to deformation and the like of semiconductors and circuit boards, it is necessary to have some elasticity incorporated within bump electrodes. The bump electrodes disclosed by the present invention have resin bumps with numerous cavities disposed within and covered by a low melting point metal layer. According to this composition, even when there are some variations of distribution in circuit board warp and bump electrode height, it is possible to absorb the variations through the elasticity presented by the bump electrodes. It is also possible to perform a low strain connection with a resultant enhancement in connecting reliability at high temperature.