| 摘要 |
PROBLEM TO BE SOLVED: To provide an atomic diffusion bonding method which permits bonding without heating even under the atmospheric pressure.SOLUTION: A bonding film having a fine crystal structure made of a metal besides Au or Au alloy, of which the body diffusion coefficient at a room temperature is 1×10(m/s) or more is formed on flat smooth surfaces of one side and the other side of base bodies in a vacuum container and, at the same time, a protective film having a fine crystal structure made of Au or Au alloy is formed on the bonding film and, under an environment of a pressure containing an atmospheric pressure beyond 1×10Pa, the flat smooth surfaces of one side and the other side of the base bodies are superimposed on each other such that the protective films are brought into contact with each other. Thereby, atomic rearrangement produced between the protective films is transferred to the bonding film, the protective film and the bonding film are integrated, thereby, the protective film on the bonding boundary is diffused, therefore, characteristics thereof are lost and, as the result, the bonding part of which physical characteristics of the bonding film are maintained is prepared.SELECTED DRAWING: Figure 1 |
