| 主权项 |
1. An apparatus comprising:
a microelectronic device mounting substrate that includes a bond pad with a side wall thereof and an upper surface thereof; a dielectric first layer disposed on the microelectronic device mounting substrate, wherein the dielectric first layer abuts the bond pad side wall and a portion of the bond pad upper surface; a solder mask second layer disposed on the dielectric first layer; a uniform recess through the solder mask second layer and the dielectric first layer that exposes the portion of the bond pad upper surface, wherein the uniform recess comprises the dielectric first layer having a sidewall that has a pitch angle and the solder mask second layer having a sidewall that has a pitch angle, wherein the sidewall of the solder mask second layer extends completely through the solder mask second layer to the sidewall of the dielectric first layer, wherein the sidewall of the dielectric first layer extends from the sidewall of the solder mask second layer to the bond pad upper surface, and wherein the sidewall pitch angle of the dielectric first layer differs from the sidewall pitch angle of the solder mask second layer; an electrical connection disposed in the recess and in physical contact with the sidewall of the dielectric first layer and with the sidewall of the solder mask second layer, and in electrical contact with the bond pad; and a microelectronic device including an active surface, wherein the active surface faces the bond pad upper surface, and wherein the active surface is bonded to the electrical connection. |
